Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-P80C32X2FN,112 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Migrating from 8/16-Bit MCUs to 32-Bit ARMs | |
| Design Resources | Development Tool Selector | |
| PCN Obsolescence/ EOL | Multiple Devices 01/Jul/2014 MCU Dip Supply Situation 12/May/2015 | |
| PCN Design/Specification | Plating Process DIP Packages 16/Sep/2013 | |
| PCN Packaging | Date Code Extended 18/Jul/2013 | |
| Standard Package | 9 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | 80C | |
| Packaging | Tube | |
| Core Processor | 8051 | |
| Core Size | 8-Bit | |
| Speed | 33MHz | |
| Connectivity | EBI/EMI, UART/USART | |
| Peripherals | POR | |
| Number of I/O | 32 | |
| Program Memory Size | - | |
| Program Memory Type | ROMless | |
| EEPROM Size | - | |
| RAM Size | 256 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 40-DIP (0.600", 15.24mm) | |
| Supplier Device Package | 40-DIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | P80C32X2FN,112 | |
| Related Links | P80C32X, P80C32X2FN,112 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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