Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PC6-UNCLAD | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Prototyping Products | |
| Family | Prototype Boards Unperforated | |
| Series | - | |
| Proto Board Type | Unclad (No Copper) | |
| Size / Dimension | 6.00" x 4.00" (152.4mm x 101.6mm) | |
| Board Thickness | 0.062" (1.57mm) 1/16" | |
| Material | FR4 Epoxy Glass | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PC6-UNCLAD | |
| Related Links | PC6-U, PC6-UNCLAD Datasheet, Injectorall Electronics Distributor | |
![]() | ERJ-S1TF1623U | RES SMD 162K OHM 1% 1W 2512 | datasheet.pdf | |
![]() | ASM36DTMT-S189 | CONN EDGECARD 72POS R/A .156 SLD | datasheet.pdf | |
![]() | 2N6509TG | THYRISTOR SCR 25A 800V TO220AB | datasheet.pdf | |
![]() | 66900-144 | DUAL POL QKE W/30 AU | datasheet.pdf | |
![]() | LGA10C-00SADJJ | CONVERTER DC/DC 10A ADJ OUT | datasheet.pdf | |
![]() | 7-1676480-3 | RES SMD 560K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | A3P250-2QNG132 | IC FPGA 87 I/O 132QFN | datasheet.pdf | |
![]() | RNC50H28R0FSB14 | RES 28 OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | 0315005.MXSLP | FUSE GLASS 5A 250VAC 3AB 3AG | datasheet.pdf | |
![]() | 1385829-1 | HDM SAPR100F174O LM | datasheet.pdf | |
![]() | 91-569782-35G | TVS07RF-11-35PA W/ PC CON | datasheet.pdf | |
![]() | MAL214094226E3 | 2200UF 10V 12,5X25MM 125C 3000H | datasheet.pdf |