Microchip Technology PIC16F1825-I/ML
- Mfg. Part Number
- PIC16F1825-I/ML
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 8BIT 14KB FLASH 16QFN
- Datasheet Download
- PIC16F1825-I/ML.pdf
Availability of PIC16F1825-I/ML
Available Quantity
8516 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 1.14000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC16F1825-I/ML, we specialize in Microchip Technology all series electronic components. PIC16F1825-I/ML can be shipped within 24 hours after order. If you have any demands for PIC16F1825-I/ML, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC16F1825-I/ML Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC16F1825-I/ML
| Internal Part Number | EIS-PIC16F1825-I/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | mTouch Capacitive Touch Sensing | |
| Design Resources | Development Tool Selector | |
| Featured Product | Extreme Low Power (XLP) Microcontrollers | |
| PCN Design/Specification | PIC16(L)F1825,9 Errata and Datasheet Update 18/Oct/2013 PIC16(L)F1825/1829 Errata/Datasheet Update 22/Jan/2014 PIC16(L)F1825,1829 Errata/Datasheet Update 18/Apr/2014 PIC16(L)F1825,1829 Datasheet Update 22/May/2014 Errata/Datasheet Update 10/Oct/2014 Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 Datasheet Update 16/Apr/2015 | |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 91 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ mTouch™ 16F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 8-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 11 | |
| Program Memory Size | 14KB (8K x 14) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 256 x 8 | |
| RAM Size | 1K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 5.5 V | |
| Data Converters | A/D 8x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-VQFN Exposed Pad | |
| Supplier Device Package | 16-QFN-EP (4x4) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC16F1825-I/ML | |
| Related Links | PIC16F1, PIC16F1825-I/ML Datasheet, Microchip Technology Distributor | |
PIC16F1825-I/ML Details Description
Related parts for PIC16F1825-I/ML
 | MGDU4-00010 | FIXED IND 220UH 700MA 440 MOHM | datasheet.pdf | |
 | RG2012P-124-D-T5 | RES SMD 120K OHM 0.5% 1/8W 0805 | datasheet.pdf | |
 | DTC114EUBTL | TRANS PREBIAS NPN 200MW UMT3F | datasheet.pdf | |
 | VI-2TP-EY-F3 | CONVERTER MOD DC/DC 13.8V 50W | datasheet.pdf | |
 | 0982670903 | 1MM JMPR LGT 76 TYPE A 21POS | datasheet.pdf | |
| B82141A1393K | FIXED IND 39UH 285MA 1.21 OHM TH | datasheet.pdf | |
 | 1200661042 | CORD 5POS FEMALE/MALE 9M 18AWG | datasheet.pdf | |
| 1156800000 | SL 7.62IT/04/90MF2 3.2 SN OR | datasheet.pdf | |
| 86506-412HLF | HEADER BERGSTIK | datasheet.pdf | |
| V707025100J0G | 762 TB SOCKET WF RA | datasheet.pdf | |
-MHQ-Series.jpg) | MHQ0402P4N4JT000 | FIXED IND 4.4NH 200MA 700 MOHM | datasheet.pdf | |
| BACC63BV16H10S7 | 26500 10C 10#16 S RECP AN WC | datasheet.pdf |