Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC16F722-E/SS | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | 8-bit PIC® Microcontroller Portfolio | |
| Design Resources | Development Tool Selector | |
| Featured Product | Extreme Low Power (XLP) Microcontrollers | |
| PCN Design/Specification | PIC16(L)F72X Errata and Datasheet Update 04/Oct/2013 Copper Bond Wire 17/Dec/2014 | |
| PCN Assembly/Origin | Mold Compound Update 30/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 47 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 16F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 8-Bit | |
| Speed | 20MHz | |
| Connectivity | I²C, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 25 | |
| Program Memory Size | 3.5KB (2K x 14) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 128 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 5.5 V | |
| Data Converters | A/D 11x8b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 28-SSOP (0.209", 5.30mm Width) | |
| Supplier Device Package | 28-SSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC16F722-E/SS | |
| Related Links | PIC16F7, PIC16F722-E/SS Datasheet, Microchip Technology Distributor | |
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