Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC16LC57C-04/SS | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Asynchronous Stimulus | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Bond Wire 17/Dec/2014 | |
| PCN Assembly/Origin | Mold Compound Update 30/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 47 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® 16C | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 8-Bit | |
| Speed | 4MHz | |
| Connectivity | - | |
| Peripherals | POR, WDT | |
| Number of I/O | 20 | |
| Program Memory Size | 3KB (2K x 12) | |
| Program Memory Type | OTP | |
| EEPROM Size | - | |
| RAM Size | 72 x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.5 V ~ 5.5 V | |
| Data Converters | - | |
| Oscillator Type | External | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 28-SSOP (0.209", 5.30mm Width) | |
| Supplier Device Package | 28-SSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC16LC57C-04/SS | |
| Related Links | PIC16LC5, PIC16LC57C-04/SS Datasheet, Microchip Technology Distributor | |
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