Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC18F25K20-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | PIC18 K-Series XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC18F(2,4)xK20 Errata/Datasheet 22/May/2013 Errata and Datasheet Update 20/Dec/2013 Datasheet/Errata Update 09/Apr/2014 Errata/Datasheet Update 07/Aug/2014 Copper Bond Wire 07/Apr/2015 Errata/Datasheet Update 22/Sep/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 18K | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 8-Bit | |
| Speed | 64MHz | |
| Connectivity | I²C, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 32KB (16K x 16) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 256 x 8 | |
| RAM Size | 1.5K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 11x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC18F25K20-I/SP | |
| Related Links | PIC18F25, PIC18F25K20-I/SP Datasheet, Microchip Technology Distributor | |
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