Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC18LF65K80-I/MR | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | 8-bit PIC® Microcontroller Portfolio | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Mold Compound Update 31/Oct/2014 Copper Bond Wire Update 16/Mar/2015 | |
PCN Assembly/Origin | Assembly Site Addition 22/Jun/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® XLP™ 18K | |
Packaging | Tube | |
Core Processor | PIC | |
Core Size | 8-Bit | |
Speed | 64MHz | |
Connectivity | ECAN, I²C, LIN, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
Number of I/O | 54 | |
Program Memory Size | 32KB (16K x 16) | |
Program Memory Type | FLASH | |
EEPROM Size | 1K x 8 | |
RAM Size | 3.6K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
Data Converters | A/D 11x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 64-VFQFN Exposed Pad | |
Supplier Device Package | 64-QFN Exposed Pad (9x9) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC18LF65K80-I/MR | |
Related Links | PIC18LF6, PIC18LF65K80-I/MR Datasheet, Microchip Technology Distributor |
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