Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC24F08KA101-I/MQ | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | PIC24F16KA102 Datasheet/Errata Update 30/Jan/2014 PIC24F16KA102 Errata/Datasheet Update 15/Apr/2014 Dataheet/Errata Update 10/Jul/2014 Mold Compound Update 31/Oct/2014 Errata/Datasheet Update 13/Jul/2015 | |
PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 73 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® XLP™ 24F | |
Packaging | Tube | |
Core Processor | PIC | |
Core Size | 16-Bit | |
Speed | 32MHz | |
Connectivity | I²C, IrDA, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
Number of I/O | 18 | |
Program Memory Size | 8KB (2.75K x 24) | |
Program Memory Type | FLASH | |
EEPROM Size | 512 x 8 | |
RAM Size | 1.5K x 8 | |
Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
Data Converters | A/D 9x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 20-VQFN Exposed Pad | |
Supplier Device Package | 20-QFN (5x5) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC24F08KA101-I/MQ | |
Related Links | PIC24F08K, PIC24F08KA101-I/MQ Datasheet, Microchip Technology Distributor |
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