Microchip Technology PIC24F08KA102-I/SP
- Mfg. Part Number
- PIC24F08KA102-I/SP
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 8KB FLASH 28SDIP
- Datasheet Download
- PIC24F08KA102-I/SP.pdf
Availability of PIC24F08KA102-I/SP
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 1.91000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24F08KA102-I/SP, we specialize in Microchip Technology all series electronic components. PIC24F08KA102-I/SP can be shipped within 24 hours after order. If you have any demands for PIC24F08KA102-I/SP, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24F08KA102-I/SP Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24F08KA102-I/SP
| Internal Part Number | EIS-PIC24F08KA102-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24F16KA102 Datasheet/Errata Update 30/Jan/2014 PIC24F16KA102 Errata/Datasheet Update 15/Apr/2014 Dataheet/Errata Update 10/Jul/2014 Copper Bond Wire 07/Apr/2015 Errata/Datasheet Update 13/Jul/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 8KB (2.75K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 1.5K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F08KA102-I/SP | |
| Related Links | PIC24F08K, PIC24F08KA102-I/SP Datasheet, Microchip Technology Distributor | |
PIC24F08KA102-I/SP Details Description
Related parts for PIC24F08KA102-I/SP
 | 89073-1117 | 1117 METRAL HDR 1MX4R PF | datasheet.pdf | |
 | 06031A270JAT4A | CAP CER 27PF 100V NP0 0603 | datasheet.pdf | |
 | EP3SL50F780C3N | IC FPGA 488 I/O 780FBGA | datasheet.pdf | |
 | V23079C1103B301 | RELAY GEN PURPOSE DPDT 2A 12V | datasheet.pdf | |
 | VI-J5Y-EY-S | CONVERTER MOD DC/DC 3.3V 33W | datasheet.pdf | |
 | LTC4252CCMS-2#TRPBF | IC CTLR HOT SWAP NEG VOLT 10MSOP | datasheet.pdf | |
| RWR89N38R3FRB12 | RES 38.3 OHM 3W 1% WW AXIAL | datasheet.pdf | |
 | XC7A100T-1FGG676C | IC FPGA 300 I/O 676FBGA | datasheet.pdf | |
| ATS-13B-202-C2-R0 | HEATSINK 54X54X6MM XCUT T766 | datasheet.pdf | |
 | DC1508B-B | PROGRAMMER EEPROM LTPOWERPLAY | datasheet.pdf | |
| BFC238364822 | CAP FILM 8.2NF 5% 2000VDC RAD | datasheet.pdf | |
| 2M801-009-01ZNU13-2SA | M801 2C 2#12 SKT RECP OM | datasheet.pdf |