Microchip Technology PIC24F08KL302-I/SP
- Mfg. Part Number
- PIC24F08KL302-I/SP
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 8KB FLASH 28SDIP
- Datasheet Download
- PIC24F08KL302-I/SP.pdf
Availability of PIC24F08KL302-I/SP
Available Quantity
5108 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 1.38000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24F08KL302-I/SP, we specialize in Microchip Technology all series electronic components. PIC24F08KL302-I/SP can be shipped within 24 hours after order. If you have any demands for PIC24F08KL302-I/SP, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24F08KL302-I/SP Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24F08KL302-I/SP
| Internal Part Number | EIS-PIC24F08KL302-I/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Low Cost PIC24F KL Family Overview Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24F16KL402 Datasheet Revision 12/Nov/2013 PIC24F16KL402 Errata Update 17/Mar/2014 Copper Bond Wire 07/Apr/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 22/Apr/2014 Qualification Revision 23/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 8KB (2.75K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 256 x 8 | |
| RAM Size | 1K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | - | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F08KL302-I/SP | |
| Related Links | PIC24F08K, PIC24F08KL302-I/SP Datasheet, Microchip Technology Distributor | |
PIC24F08KL302-I/SP Details Description
Related parts for PIC24F08KL302-I/SP
 | SSQ-131-02-G-S-RA | Connector Receptacle 31 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
| RBM36DRMD | CONN EDGECARD 72POS .156 WW | datasheet.pdf | |
 | 1103436-1 | CONN HSG BASE ASSY PNL MNT METAL | datasheet.pdf | |
 | XBDAWT-00-0000-00000P7E8 | LED XLAMP WARM WHITE 2700K 2SMD | datasheet.pdf | |
| MI-25W-IX-F2 | CONVERT DC/DC 155VIN 5.5VOUT 75W | datasheet.pdf | |
| JBXFD2J19FSSDSR | CONN PLUG 19P INLINE SKT SLD | datasheet.pdf | |
| ATS-12B-149-C2-R0 | HEATSINK 35X35X20MM L-TAB T766 | datasheet.pdf | |
| 4308H-102-682 | RES ARRAY 4 RES 6.8K OHM 8SIP | datasheet.pdf | |
| L77SDC37S1ACH4FC309 | D-Sub Connector Receptacle, Female Sockets 37 Position Through Hole, Right Angle Solder | datasheet.pdf | |
 | AEE02C18-L | CONV DC/DC 2.67A 15V | datasheet.pdf | |
 | XTEAWT-00-0000-000000JE5 | LED XLAMP XT-E 4000K WHITE SMD | datasheet.pdf | |
| TV06DZ-9-9S-LC | HD 38999 9C 9#23 SKT PLUG | datasheet.pdf |