Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC24F16KA302T-I/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24FV32KA304 Errata Datasheet Revision 12/Nov/2013 Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 Errata/Datasheet Update 10/Aug/2015 | |
| PCN Assembly/Origin | Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 1,600 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
| Number of I/O | 24 | |
| Program Memory Size | 16KB (5.5K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 13x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F16KA302T-I/ML | |
| Related Links | PIC24F16K, PIC24F16KA302T-I/ML Datasheet, Microchip Technology Distributor | |
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