Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC24F32KA304-I/PT | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC24FV32KA304 Errata Datasheet Revision 12/Nov/2013 Bond Wire Update 31/Mar/2015 Errata/Datasheet Update 10/Aug/2015 | |
| PCN Assembly/Origin | Qualification Copper Wire 10/Feb/2014 Qualification Copper Wire 21/Apr/2014 Qualification Lead-Frame 03/Jun/2014 Revision with Qualification Report 22/Aug/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tray | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, LIN, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT | |
| Number of I/O | 39 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 512 x 8 | |
| RAM Size | 2K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V | |
| Data Converters | A/D 16x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 44-TQFP | |
| Supplier Device Package | 44-TQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24F32KA304-I/PT | |
| Related Links | PIC24F32K, PIC24F32KA304-I/PT Datasheet, Microchip Technology Distributor | |
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