Microchip Technology PIC24FJ32GB002-I/ML
- Mfg. Part Number
- PIC24FJ32GB002-I/ML
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 28QFN
- Datasheet Download
- PIC24FJ32GB002-I/ML.pdf
Availability of PIC24FJ32GB002-I/ML
Available Quantity
5693 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.61000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24FJ32GB002-I/ML, we specialize in Microchip Technology all series electronic components. PIC24FJ32GB002-I/ML can be shipped within 24 hours after order. If you have any demands for PIC24FJ32GB002-I/ML, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24FJ32GB002-I/ML Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24FJ32GB002-I/ML
| Internal Part Number | EIS-PIC24FJ32GB002-I/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 | |
| PCN Assembly/Origin | Additional Fabrication Site 11/Oct/2013 Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 61 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24FJ32GB002-I/ML | |
| Related Links | PIC24FJ32, PIC24FJ32GB002-I/ML Datasheet, Microchip Technology Distributor | |
PIC24FJ32GB002-I/ML Details Description
Related parts for PIC24FJ32GB002-I/ML
 | 4608X-102-683 | RES ARRAY 4 RES 68K OHM 8SIP | datasheet.pdf | |
 | MCR18EZHF9761 | RES SMD 9.76K OHM 1% 1/4W 1206 | datasheet.pdf | |
 | 3AP 2-R | FUSE GLASS 2A 250VAC 3AB 3AG | datasheet.pdf | |
 | RG1608N-80R6-W-T5 | RES SMD 80.6OHM 0.05% 1/10W 0603 | datasheet.pdf | |
 | SM4124JT25L0 | RES SMD 0.025 OHM 5% 2W 4124 | datasheet.pdf | |
| D38999/20WG16SD | CONN RCPT 16POS WALL MNT W/SCKT | datasheet.pdf | |
 | 20020107-G071A01LF | TERM BLOCK HDR 7POS VERT 5MM | datasheet.pdf | |
 | PWR4525WR036J | RES SMD 0.036 OHM 5% 2W 4525 | datasheet.pdf | |
| IEGH66-1REC4-35431-1-V | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
| EBA40DCWI-S288 | CONN EDGECARD 80POS .125" | datasheet.pdf | |
| 81-194618-1S | CONN PLUG W/SOCKETS | datasheet.pdf | |
| T38013-08-0 | Connector Barrier Block Strip 8 Circuit 0.375" (9.53mm) | datasheet.pdf |