Microchip Technology PIC24FJ32GB002-I/ML
- Mfg. Part Number
- PIC24FJ32GB002-I/ML
- Manufacturer
- Microchip Technology
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 32KB FLASH 28QFN
- Datasheet Download
- PIC24FJ32GB002-I/ML.pdf
Availability of PIC24FJ32GB002-I/ML
Available Quantity
5693 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 2.61000
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of PIC24FJ32GB002-I/ML, we specialize in Microchip Technology all series electronic components. PIC24FJ32GB002-I/ML can be shipped within 24 hours after order. If you have any demands for PIC24FJ32GB002-I/ML, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- PIC24FJ32GB002-I/ML Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
PIC24FJ32GB002-I/ML
| Internal Part Number | EIS-PIC24FJ32GB002-I/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | XLP Deep Sleep Mode Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
| PCN Design/Specification | Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 | |
| PCN Assembly/Origin | Additional Fabrication Site 11/Oct/2013 Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 61 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24FJ32GB002-I/ML | |
| Related Links | PIC24FJ32, PIC24FJ32GB002-I/ML Datasheet, Microchip Technology Distributor | |
PIC24FJ32GB002-I/ML Details Description
Related parts for PIC24FJ32GB002-I/ML
 | ERJ-2RKF1001X | RES SMD 1K OHM 1% 1/10W 0402 | datasheet.pdf | |
 | CM6296-253 | CHOKE COMMON MODE 25.0UH PARALL | datasheet.pdf | |
 | 71V321L25JI8 | IC SRAM 16KBIT 25NS 52PLCC | datasheet.pdf | |
 | RGP15AHE3/54 | DIODE GEN PURP 50V 1.5A DO204AC | datasheet.pdf | |
 | ABLS-4.433619MHZ-B4-T | Crystal 4.433619MHz 30ppm 18pF 180 Ohm -20°C - 70°C Surface Mount HC49/US | datasheet.pdf | |
 | OMAP3530DCUS72 | IC MPU OMAP-35XX 720MHZ 423FCBGA | datasheet.pdf | |
 | VI-J0F-MY | CONVERTER MOD DC/DC 72V 50W | datasheet.pdf | |
| VE-2ND-MU-F2 | CONVERTER MOD DC/DC 85V 200W | datasheet.pdf | |
 | NCV33269DR2G | IC REG LDO ADJ 0.8A 8SO | datasheet.pdf | |
 | RNC55J2803FSBSL | RES 280K OHM 1/8W 1% AXIAL | datasheet.pdf | |
| LSYMB4N-2K | NON PLUG-INLOW TEMP VERS SIDE | datasheet.pdf | |
| Y162525R5000B0R | RES SMD 25.5 OHM 0.1% 0.3W 1206 | datasheet.pdf |