Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC24FJ64GB002-I/ML | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | XLP Deep Sleep Mode Getting the Lowest Current Consumption from a PIC24F MCU Bluetooth Audio Development Platform | |
Design Resources | Development Tool Selector | |
Featured Product | PIC24FJ/33FJ MCUs & dsPIC® DSCs | |
PCN Design/Specification | Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 | |
PCN Assembly/Origin | Additional Fabrication Site 11/Oct/2013 Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification QFN-28,20,16 with Copper 09/Jan/2014 Qualification Report 28/Jan/2014 Qualification Copper Wire Revison 01/Apr/2014 Cancelation of Copper Assembly 25/Jun/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 61 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® XLP™ 24F | |
Packaging | Tube | |
Core Processor | PIC | |
Core Size | 16-Bit | |
Speed | 32MHz | |
Connectivity | I²C, IrDA, SPI, UART/USART, USB OTG | |
Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT | |
Number of I/O | 19 | |
Program Memory Size | 64KB (22K x 24) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 8K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
Data Converters | A/D 9x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 28-VQFN Exposed Pad | |
Supplier Device Package | 28-QFN (6x6) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC24FJ64GB002-I/ML | |
Related Links | PIC24FJ64, PIC24FJ64GB002-I/ML Datasheet, Microchip Technology Distributor |
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