Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC24FJ64GB202-E/SP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Datasheet Update 30/Mar/2015 Errata Data Sheet Rev 07/Jul/2015 PIC24FJ128GB204 Family Errata 28/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 15 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® XLP™ 24F | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, LIN, SmartCard, SPI, UART/USART | |
| Peripherals | AES, Brown-out Detect/Reset, DMA, I²S, HLVD, POR, PWM, WDT | |
| Number of I/O | 20 | |
| Program Memory Size | 64KB (64K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2 V ~ 3.6 V | |
| Data Converters | A/D 9x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 28-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 28-SPDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24FJ64GB202-E/SP | |
| Related Links | PIC24FJ64, PIC24FJ64GB202-E/SP Datasheet, Microchip Technology Distributor | |
![]() | AP1701FWG-7 | IC MPU RESET CIRC 2.63V SC59-3 | datasheet.pdf | |
![]() | BQ24001PWPR | IC LI-ION CHARGE MGMT 20-HTSSOP | datasheet.pdf | |
![]() | CY7C1518KV18-300BZXI | IC SRAM 72MBIT 300MHZ 165FBGA | datasheet.pdf | |
![]() | V72A3V3M264B2 | CONVERTER MOD DC/DC 3.3V 264W | datasheet.pdf | |
![]() | VI-J4M-MW-F4 | CONVERTER MOD DC/DC 10V 100W | datasheet.pdf | |
![]() | IHLP5050FDER3R3M5A | FIXED IND 3.3UH 20.2A 5.44 MOHM | datasheet.pdf | |
![]() | Y116934R0000B0R | RES SMD 34 OHM 0.1% 0.6W J LEAD | datasheet.pdf | |
![]() | 0152680235 | PREMO-FLEX 1.25 JMPR LGT 51 TYPE | datasheet.pdf | |
![]() | SG-210STF 27.0000ML3 | OSC XO 27.000MHZ CMOS SMD | datasheet.pdf | |
![]() | 0800475:R | TERM BLOCK MARKER | datasheet.pdf | |
![]() | ATS-02G-52-C1-R0 | HEATSINK 30X30X25MM L-TAB | datasheet.pdf | |
![]() | GRM21BR60J106KE19 | Dual 600mA Step-Down Converter with Synchronization IC | datasheet.pdf |