Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC24HJ32GP302-I/SO | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Assembly/Origin | SOIC-28L Palladium Coated Copper 29/Aug/2013 SOIC-28L Revision 17/Dec/2013 SOIC-28L Revision 06/Feb/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® 24H | |
| Packaging | Tube | |
| Core Processor | PIC | |
| Core Size | 16-Bit | |
| Speed | 40 MIPs | |
| Connectivity | I²C, PMP, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Number of I/O | 21 | |
| Program Memory Size | 32KB (11K x 24) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 10x10b/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 28-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 28-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC24HJ32GP302-I/SO | |
| Related Links | PIC24HJ32, PIC24HJ32GP302-I/SO Datasheet, Microchip Technology Distributor | |
| 4608X-101-562 | RES ARRAY 7 RES 5.6K OHM 8SIP | datasheet.pdf | ||
![]() | 0233002.MXE | FUSE GLASS 2A 125VAC 5X20MM | datasheet.pdf | |
![]() | RNC50H1003FPBSL | RES 100K OHM 1/10W 1% AXIAL | datasheet.pdf | |
![]() | PHP00805H1270BST1 | RES SMD 127 OHM 0.1% 5/8W 0805 | datasheet.pdf | |
![]() | SM20M1S31 | CONTACT PIN 20-22AWG CRIMP GOLD | datasheet.pdf | |
![]() | AN26065A-EVB-0 | BOARD EVAL FOR AN26065A LNA | datasheet.pdf | |
![]() | ATS-04G-86-C2-R0 | HEATSINK 35X35X15MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-P2-19-C3-R0 | HEATSINK 54X54X20MM XCUT T412 | datasheet.pdf | |
![]() | SIT3821AI-1D-25EY | OSC MEMS PROG 7.0X5.0MM 2.5V | datasheet.pdf | |
![]() | SIT3821AI-2C-25NM | OSC MEMS PROG 5.0X3.2MM 2.5V | datasheet.pdf | |
![]() | D-110-46 | SOLDERSLEEVE | datasheet.pdf | |
![]() | CTVS06RF-13-8PA | CTV 8C 8#20 PIN PLUG | datasheet.pdf |