Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC32MX130F128L-50I/PT | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Bluetooth Audio Development Platform | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | Errata/Datasheet Update 31/Jul/2015 | |
PCN Assembly/Origin | Qualification Lead-Frame Paddle 20/Oct/2014 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 119 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® 32MX | |
Packaging | Tray | |
Core Processor | MIPS32® M4K™ | |
Core Size | 32-Bit | |
Speed | 50MHz | |
Connectivity | I²C, IrDA, LIN, PMP, SPI, UART/USART | |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
Number of I/O | 85 | |
Program Memory Size | 128KB (128K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 16K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.3 V ~ 3.6 V | |
Data Converters | A/D 48x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 100-TQFP | |
Supplier Device Package | 100-TQFP (12x12) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC32MX130F128L-50I/PT | |
Related Links | PIC32MX130F, PIC32MX130F128L-50I/PT Datasheet, Microchip Technology Distributor |
![]() | M25P05-AVMN6T | IC FLASH 512KBIT 40MHZ 8SO | datasheet.pdf | |
![]() | 167Q12 | XFRMR LAMINATED 75.6VA CHAS MNT | datasheet.pdf | |
![]() | 812-22-057-30-002101 | CONN SPRING 57POS SNGL .295 SMD | datasheet.pdf | |
![]() | RMCF0603JT240K | RES SMD 240K OHM 5% 1/10W 0603 | datasheet.pdf | |
![]() | SI8423BB-B-IS | DGTL ISO 2.5KV GEN PURP 8SOIC | datasheet.pdf | |
![]() | 9-390111-1 | CONN MEM SOCKET SODIMM 144POS | datasheet.pdf | |
XC6VSX315T-3FFG1156C | IC FPGA 600 I/O 1156FCBGA | datasheet.pdf | ||
6SXB33M | CAP POLYMER 33UF 20% 6.3V SMD | datasheet.pdf | ||
![]() | 0190300051 | DIE SET (4) (MMC-AA-595) | datasheet.pdf | |
![]() | 3100U00031070 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | ATS-19H-92-C1-R0 | HEATSINK 40X40X15MM R-TAB | datasheet.pdf | |
![]() | TV07DZ-25-8S | TV 8C 8#8(TWIN) SKT J/N RECP | datasheet.pdf |