Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC32MX210F016B-V/ML | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | PIC32MX1xx/2xx Datasheet 04/Mar/2014 PIC32My1yy/2yy Errata/Datasheet Update 03/Jun/2014 Mold Compound Update 31/Oct/2014 Lead Frame Update 16/Feb/2015 Datasheet Update 31/Jul/2015 Errata/Datasheet Update 31/Jul/2015 | |
| PCN Assembly/Origin | Additional Fabrication Site 21/Jun/2013 Qualification QFN-28,20,16 Packages 26/Dec/2013 Qualification Report 28/Jan/2014 Report/Ship Date Revison 20/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 61 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Automotive, AEC-Q100, PIC® 32MX | |
| Packaging | Tube | |
| Core Processor | MIPS32® M4K™ | |
| Core Size | 32-Bit | |
| Speed | 40MHz | |
| Connectivity | I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 19 | |
| Program Memory Size | 16KB (16K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.3 V ~ 3.6 V | |
| Data Converters | A/D 10x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 28-VQFN Exposed Pad | |
| Supplier Device Package | 28-QFN (6x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC32MX210F016B-V/ML | |
| Related Links | PIC32MX210, PIC32MX210F016B-V/ML Datasheet, Microchip Technology Distributor | |
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