Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-PIC32MX320F032HT-40V/MR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Bluetooth Audio Development Platform | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Errata/Datasheet Update 06/Oct/2014 Mold Compound Update 31/Oct/2014 | |
| PCN Assembly/Origin | Assembly Site Addition 22/Jun/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Article Library | Creating Low-Cost Bluetooth Audio Applications with 32-bit MCUs | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | PIC® 32MX | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | MIPS32® M4K™ | |
| Core Size | 32-Bit | |
| Speed | 40MHz | |
| Connectivity | I²C, IrDA, LIN, PMP, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | |
| Number of I/O | 53 | |
| Program Memory Size | 32KB (32K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.3 V ~ 3.6 V | |
| Data Converters | A/D 16x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 105°C | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Supplier Device Package | 64-QFN Exposed Pad (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | PIC32MX320F032HT-40V/MR | |
| Related Links | PIC32MX320F, PIC32MX320F032HT-40V/MR Datasheet, Microchip Technology Distributor | |
![]() | 05T-JWPF-HHLE-D | CONN HOUSING TAB JWPF 5POS 2MM | datasheet.pdf | |
![]() | RG3216P-5902-B-T1 | RES SMD 59K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RGM10DTBH-S189 | CONN EDGECARD 20POS R/A .156 SLD | datasheet.pdf | |
![]() | RSF3FB8R25 | RES MO 3W 8.25 OHM 1% AXIAL | datasheet.pdf | |
![]() | LQG15HN3N3S02D | FIXED IND 3.3NH 300MA 190 MOHM | datasheet.pdf | |
![]() | SOMC160356K0GEA | RES ARRAY 8 RES 56K OHM 16SOIC | datasheet.pdf | |
![]() | ECQ-E12472JFB | CAP FILM 4700PF 5% 1.25KVDC RAD | datasheet.pdf | |
![]() | CMF50100R00BHEK | RES 100 OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | 150-80-624-00-012101 | DIL SURFACE MOUNT 2.54MM | datasheet.pdf | |
![]() | ATS-18F-28-C1-R0 | HEATSINK 70X70X15MM XCUT | datasheet.pdf | |
![]() | MS27467T13A98SA | LJT 10C 10#20 SKT PLUG | datasheet.pdf | |
![]() | XCV1000E-7BG680C | IC FPGA 404 I/O 560MBGA | datasheet.pdf |