Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-PIC32MZ1024ECM144-I/PL | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Bluetooth Audio Development Platform | |
Design Resources | Development Tool Selector | |
PCN Design/Specification | PIC32MZ Errata/Datasheet Update 13/Oct/2014 PIC32MZ Die Update 13/Oct/2014 Errata/Datasheet Update 16/Dec/2014 Dattasheet Update 07/Apr/2015 Errata/Datasheet Update 31/Jul/2015 Errata/Datasheet Update 22/Sep/2015 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | PIC® 32MZ | |
Packaging | Tray | |
Core Processor | MIPS32® microAptiv™ | |
Core Size | 32-Bit | |
Speed | 200MHz | |
Connectivity | CAN, EBI/EMI, Ethernet, I²C, SPI, SQI, UART/USART, USB OTG | |
Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
Number of I/O | 120 | |
Program Memory Size | 1MB (1M x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 512K x 8 | |
Voltage - Supply (Vcc/Vdd) | 2.3 V ~ 3.6 V | |
Data Converters | A/D 48x12b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 144-LQFP | |
Supplier Device Package | 144-LQFP (20x20) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | PIC32MZ1024ECM144-I/PL | |
Related Links | PIC32MZ1024, PIC32MZ1024ECM144-I/PL Datasheet, Microchip Technology Distributor |
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