Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-POZ3KN-1-501N-T04 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by MURATA | |
| Delivery Time | In stock, ship POZ3KN-1-501N-T04 today. | |
| Series | POZ3KN-1-5 | |
| Marking / Symbol | Email us | |
| Tolerance | - | |
| Capacitance | - | |
| Features | - | |
| Voltage | - | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Mounting Type | SMD Surface Mount / Through Hole | |
| Packaging | Reel / Bag | |
| Package Case Type | SMD | |
| SPQ (Standard Package Quantity) | - | |
| MOQ | 1 Piece | |
| Application | Electronic Device | |
| Alternative Part (Replacement) | EIS-POZ3KN-1-501N-T04 | |
| Country of Origin | JAPAN/THAILAND/USA/CN | |
| Weight | 0.0005kg | |
| Additional Services | Reel and tape, testing services | |
| Distributor | EIS COMPONENTS | |
| MURATA Product Category | MURATA Components | |
| Related Links | POZ3KN-1, POZ3KN-1-501N-T04 Datasheet, Murata Electronics North America Distributor | |
![]() | AN7705SP | IC REG LDO 5V 1.2A SP3SUA | datasheet.pdf | |
![]() | PIC17LC756A-08/L | IC MCU 8BIT 32KB OTP 68PLCC | datasheet.pdf | |
![]() | 76382-432 | CONN HEADER 32POS .100" R/A TIN | datasheet.pdf | |
![]() | LT3020IDD-1.5#TRPBF | IC REG LDO 1.5V 0.1A 8DFN | datasheet.pdf | |
![]() | NSR0240HT1G | DIODE SCHOTTKY 40V 250MA SOD323 | datasheet.pdf | |
![]() | BCS9329 | BCH5X30 SERIES HAND FREE STAND | datasheet.pdf | |
![]() | A1440A-1VQ100I | IC FPGA 83 I/O 100VQFP | datasheet.pdf | |
![]() | MAX9273GTL/V+T | IC SERIALIZER 22BIT GMSL 40TQFN | datasheet.pdf | |
![]() | SST-50-W65S-F21-H2102 | BIG CHIP LED HB MODULE WHITE | datasheet.pdf | |
![]() | 0800556:F | TERM BLOCK MARKER | datasheet.pdf | |
![]() | BFC237872164 | CAP FILM 160NF 5% 1000VDC RAD | datasheet.pdf | |
![]() | EP7309-CR-C | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |