Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-R5F10Y17ASP#50 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 2,500 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | RL78/G10 | |
Packaging | Tape & Reel (TR) | |
Core Processor | RL78 | |
Core Size | 16-Bit | |
Speed | 20MHz | |
Connectivity | CSI, I²C, LIN, UART/USART | |
Peripherals | DMA, LVD, POR, PWM, WDT | |
Number of I/O | 6 | |
Program Memory Size | 4KB (4K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 512 x 8 | |
Voltage - Supply (Vcc/Vdd) | 2 V ~ 5.5 V | |
Data Converters | A/D 4x8/10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 10-LSSOP (0.173", 4.40mm Width) | |
Supplier Device Package | 10-LSSOP (4.4x3.6) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | R5F10Y17ASP#50 | |
Related Links | R5F10Y1, R5F10Y17ASP#50 Datasheet, Renesas Electronics America Distributor |
MSP430F2101IDWR | IC MCU 16BIT 1KB FLASH 20SOIC | datasheet.pdf | ||
101-1051 | MODULE MEMORY CORE RCM3365 | datasheet.pdf | ||
ICS95V857ALT | IC CLK BUF DDR 233MHZ 1CIRC | datasheet.pdf | ||
NX5DV330EVB | BOARD EVALUATION FOR NX5DV330 | datasheet.pdf | ||
ASB2EP | TERM BLOCK DIN 5MM END PLATE | datasheet.pdf | ||
2703994 | BUS COUPLER 8INPUT 4OUTPUT | datasheet.pdf | ||
VI-B30-IU-B1 | CONVERTER MOD DC/DC 5V 200W | datasheet.pdf | ||
VS-10ETF06SPBF | DIODE GEN PURP 600V 10A D2PAK | datasheet.pdf | ||
1516726 | SENSOR ACTUATOR BOX | datasheet.pdf | ||
AMC18DCKS-S288 | CONN EDGECARD 36POS .100" | datasheet.pdf | ||
HW21100000J0G | 350 TB SPRING PLUG | datasheet.pdf | ||
IELR111-1-61-7.50-91-V | CIR BRKR MAG-HYDR LEVER 7.5A | datasheet.pdf |