Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-R5F61668RD50BGV | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | H8® H8SX/1600 | |
| Packaging | Tray | |
| Core Processor | H8SX | |
| Core Size | 32-Bit | |
| Speed | 50MHz | |
| Connectivity | EBI/EMI, I²C, IrDA, SCI, SmartCard, USB | |
| Peripherals | DMA, LVD, POR, PWM, WDT | |
| Number of I/O | 92 | |
| Program Memory Size | 1MB (1M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 56K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3 V ~ 3.6 V | |
| Data Converters | A/D 8x10b; D/A 2x8b | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 176-LFBGA | |
| Supplier Device Package | 176-LFBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | R5F61668RD50BGV | |
| Related Links | R5F6166, R5F61668RD50BGV Datasheet, Renesas Electronics America Distributor | |
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