Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-RC48F4400P0TB0EJ | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 28/Nov/2014 | |
| Standard Package | 864 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | Axcell™ | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 512M (32M x 16) | |
| Speed | 95ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-TBGA | |
| Supplier Device Package | 64-EasyBGA (8x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | RC48F4400P0TB0EJ | |
| Related Links | RC48F440, RC48F4400P0TB0EJ Datasheet, Micron Technology Distributor | |
![]() | 15-43-7580 | CONN MOD JACK 8P2C R/A UNSHLD | datasheet.pdf | |
![]() | 2352-1-01-44-00-00-07-0 | CONN PC PIN CIRC 0.094DIA SILVER | datasheet.pdf | |
![]() | RG3216N-8661-C-T5 | RES SMD 8.66KOHM 0.25% 1/4W 1206 | datasheet.pdf | |
![]() | RCB24DHHN | CONN EDGECARD 48POS DIP .050 SLD | datasheet.pdf | |
![]() | RBC30DRXN-S734 | CONN EDGECARD 60POS DIP .100 SLD | datasheet.pdf | |
![]() | N1WS1088 | BOX STEEL GRAY 10"L X 8"W | datasheet.pdf | |
![]() | J7TKN-B-4 | RELAY THERMAL OVERLOAD 2.7-4A | datasheet.pdf | |
![]() | Y112130K0000B9L | RES SMD 30KOHM 0.1% 0.16W J LEAD | datasheet.pdf | |
![]() | MTCMR-C2-N3-NAM | MODEM CELLULAR DUAL CDMA | datasheet.pdf | |
![]() | ATS-03G-24-C1-R0 | HEATSINK 60X60X20MM XCUT | datasheet.pdf | |
![]() | LT3065MPDD-3.3#PBF | IC REG LDO 3.3V 0.5A 10DFN | datasheet.pdf | |
![]() | MKT1813233636G | CAP FILM 3.3NF 20% 630VDC AXIAL | datasheet.pdf |