Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-RL2008-36.9K-150-D1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 2,500 | |
| Category | Sensors, Transducers | |
| Family | Thermistors - NTC | |
| Series | RL2008 | |
| Packaging | Bulk | |
| Resistance in Ohms @ 25°C | 70k | |
| Resistance Tolerance | ±10% | |
| B Value Tolerance | - | |
| B0/50 | - | |
| B25/50 | - | |
| B25/75 | - | |
| B25/85 | 4220K | |
| B25/100 | - | |
| Operating Temperature | -50°C ~ 150°C | |
| Power - Max | - | |
| Length - Lead Wire | 1.50" (38.00mm) | |
| Mounting Type | Through Hole | |
| Package / Case | Disc, 5.6mm Dia x 4.3mm W | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | RL2008-36.9K-150-D1 | |
| Related Links | RL2008-36, RL2008-36.9K-150-D1 Datasheet, Amphenol Advanced Sensors (formerly GE Sensing) Distributor | |
![]() | XCV1600E-7FG860I | IC FPGA 660 I/O 860FBGA | datasheet.pdf | |
![]() | TLV2252IP | IC OPAMP GP 200KHZ RRO 8DIP | datasheet.pdf | |
![]() | DS1831CS+ | IC MULTIMON 3.3/2.5V 16-SOIC | datasheet.pdf | |
![]() | MS3108R20-7P | CONN PLUG 8 POS RT ANG W/PINS | datasheet.pdf | |
![]() | RNC55H1202FSB14 | RES 12K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | M39003/01-6035/HSD | CAP TANT 100UF 5% 10V AXIAL | datasheet.pdf | |
![]() | MAX31913AUI+ | IC TXRX OCTAL DIGITAL INP TSSOP | datasheet.pdf | |
![]() | 801-87-034-10-173101 | Connector Socket 34 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 1669068 | CABLE 3POS | datasheet.pdf | |
![]() | 885012208014 | CAP CER 1.5UF 10V X7R 1206 | datasheet.pdf | |
![]() | D38999/24JH21PA | CONN HSG RCPT JAM NUT 21POS SKT | datasheet.pdf | |
![]() | XC2V150-6BG352C | XILINX IC XC2V150-6BG352C Available | datasheet.pdf |