Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-RN60D23R2FBSL | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 100 | |
Category | Resistors | |
Family | Through Hole Resistors | |
Series | Military, MIL-R-10509/1, RN60 | |
Packaging | Bulk | |
Resistance (Ohms) | 23.2 | |
Tolerance | ±1% | |
Power (Watts) | 0.25W, 1/4W | |
Composition | Metal Film | |
Features | Flame Retardant Coating, Military, Moisture Resistant, Safety | |
Temperature Coefficient | ±100ppm/°C | |
Package / Case | Axial | |
Supplier Device Package | Axial | |
Size / Dimension | 0.145" Dia x 0.344" L (3.68mm x 8.74mm) | |
Height | - | |
Number of Terminations | 2 | |
Failure Rate | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | RN60D23R2FBSL | |
Related Links | RN60D2, RN60D23R2FBSL Datasheet, Vishay/Dale Distributor |
![]() | HLMP-0401 | LED YLW DIFF 7.3X2.4MM RECT T/H | datasheet.pdf | |
XC5VLX30-1FFG676C | IC FPGA 400 I/O 676FCBGA | datasheet.pdf | ||
![]() | RN55C4871BB14 | RES 4.87K OHM 1/8W 0.1% AXIAL | datasheet.pdf | |
![]() | M55342H06B218DRWS | RES SMD 218 OHM 1% 0.15W 0705 | datasheet.pdf | |
![]() | M55342H11B38E3RWS | RES SMD 38.3K OHM 1% 1/20W 0402 | datasheet.pdf | |
![]() | CMF605R6000JLBF | RES 5.6 OHM 1W 5% AXIAL | datasheet.pdf | |
PDB182-K430K-503A | POT 50K OHM 0.06W CARBON LOG | datasheet.pdf | ||
![]() | SK36/TR13 | DIODE SCHOTTKY 60V 3A DO214AB | datasheet.pdf | |
![]() | ATS-02C-52-C1-R0 | HEATSINK 30X30X25MM L-TAB | datasheet.pdf | |
![]() | CB3-3I-8M0000 | OSC XO 8.000MHZ HCMOS TTL SMD | datasheet.pdf | |
![]() | 97-79-161 | WATER TIGHT BUSHING | datasheet.pdf | |
![]() | BLA2ABB220SN4PD | Capacitors Inductors Filters... | datasheet.pdf |