Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-RNR55H25R5FMB14 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 100 | |
| Category | Resistors | |
| Family | Through Hole Resistors | |
| Series | Military, MIL-PRF-55182/01, RNR55 | |
| Packaging | Bulk | |
| Resistance (Ohms) | 25.5 | |
| Tolerance | ±1% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Metal Film | |
| Features | Military, Moisture Resistant | |
| Temperature Coefficient | ±50ppm/°C | |
| Package / Case | Axial | |
| Supplier Device Package | Axial | |
| Size / Dimension | 0.094" Dia x 0.250" L (2.39mm x 6.35mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Failure Rate | M (1%) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | RNR55H25R5FMB14 | |
| Related Links | RNR55H2, RNR55H25R5FMB14 Datasheet, Vishay/Dale Distributor | |
![]() | 104340-1 | CONN HEADER 10POS R/A .100 GOLD | datasheet.pdf | |
![]() | 9T12062A26R1CBHFT | RES SMD 26.1 OHM 0.25% 1/8W 1206 | datasheet.pdf | |
![]() | CRCW040212R1FKED | RES SMD 12.1 OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | RR1220P-3090-D-M | RES SMD 309 OHM 0.5% 1/10W 0805 | datasheet.pdf | |
![]() | EMC05DRTI-S93 | CONN EDGECARD 10POS DIP .100 SLD | datasheet.pdf | |
![]() | 292132-9 | CONN HEADER 9POS VERT PCB TIN | datasheet.pdf | |
![]() | 1-1589472-4 | CONN PLUG 9POS 30AWG 18IN | datasheet.pdf | |
![]() | REC5-4809SRW/H4/C/SMD | CONV DC/DC 5W 36-72VIN 09VOUT | datasheet.pdf | |
![]() | VE-2NR-CU-F1 | CONVERTER MOD DC/DC 7.5V 200W | datasheet.pdf | |
![]() | RWR82S6R81FSRSL | RES 6.81 OHM 1.5W 1% AXIAL | datasheet.pdf | |
![]() | MCR01MRTF3002 | RES SMD 30K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | EP7312-ER-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |