Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S200 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Soder-Wick® Lead-Free | |
| MSDS Material Safety Datasheet | S200-72 MSDS | |
| Standard Package | 24 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Solder | |
| Series | CircuitWorks® | |
| Process | Lead Free | |
| Type | Wire Solder | |
| Flux Type | Rosin Mildly Activated (RMA) | |
| Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | |
| Wire Gauge | 18 AWG, 19 SWG | |
| Diameter | 0.04" (1.02mm) | |
| Core Size | 3% | |
| Form | - | |
| Melting Point | 419 ~ 424°F (215 ~ 218°C) | |
| Shipping Info | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S200 | |
| Related Links | S2, S200 Datasheet, Chemtronics Distributor | |
![]() | 76RSB02 | SWITCH 2POS DIP RECESS ROCK UNSL | datasheet.pdf | |
![]() | MCS04020C1374FE000 | RES SMD 1.37M OHM 1% 1/10W 0402 | datasheet.pdf | |
![]() | RT0402FRE074K3L | RES SMD 4.3K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | GBM25DRYI-S13 | CONN EDGECARD 50POS .156 EXTEND | datasheet.pdf | |
![]() | MSP430F2131TPW | IC MCU 16BIT 8KB FLASH 20TSSOP | datasheet.pdf | |
![]() | LTC6256IKC#TRPBF-ES | IC OPAMP GP 6.5MHZ RRO 8UTDFN | datasheet.pdf | |
![]() | 290AEX | XFRMR LAMINATED CHAS MOUNT | datasheet.pdf | |
![]() | IDGN66-28507-1 | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
![]() | MCR03ERTF1304 | RES SMD 1.3M OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | 5443661 | TERM BLOCK HEADER | datasheet.pdf | |
![]() | PT00SE-14-5P(108) | CONN RCPT 5POS WALL MNT PIN | datasheet.pdf | |
![]() | BZX84C36-HE3-18 | DIODE ZENER 36V 300MW SOT23-3 | datasheet.pdf |