Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S25FL256SAGBHI200 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | MX25L25635F Migrating from S25FL256S | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 338 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | FL-S | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 256M (32M x 8) | |
| Speed | 133MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 24-TBGA | |
| Supplier Device Package | 24-BGA (6x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S25FL256SAGBHI200 | |
| Related Links | S25FL256, S25FL256SAGBHI200 Datasheet, Spansion Distributor | |
![]() | DS1386-32-120 | IC RTC CLK/CALENDAR PAR 32-DIP | datasheet.pdf | |
![]() | LTC2627IDE-1#TRPBF | IC DAC 12BIT R-R I2C 12-DFN | datasheet.pdf | |
![]() | DEM-OPA-SSOP-3B | DEM-OPA-SSOP-3B | datasheet.pdf | |
| 3-647630-3 | CONN HEADER 3POS R/A TIN .100 | datasheet.pdf | ||
![]() | VE-B41-CW-F2 | CONVERTER MOD DC/DC 12V 100W | datasheet.pdf | |
![]() | RLR20C7153FMB14 | RES 715K OHM 1% 1/2W AXIAL | datasheet.pdf | |
![]() | 18-012-105 | DIP CABLE 18POS | datasheet.pdf | |
| TM1SF10M4 | PUSH MNT .616''X.401'' WH | datasheet.pdf | ||
![]() | 93216-408HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ACC70DKAN-S1191 | CONN EDGECARD 140POS .100" | datasheet.pdf | |
![]() | OQ08125103J0G | 350 TB SOCKET RA W/LATCH | datasheet.pdf | |
![]() | 687ULR4R0MFH | CAP POLY 680UF 20% 4V T/H | datasheet.pdf |