Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S25FL512SAGMFI013 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,450 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | FL-S | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 512M (64M x 8) | |
| Speed | 133MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) | |
| Supplier Device Package | 16-SOIC | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S25FL512SAGMFI013 | |
| Related Links | S25FL512, S25FL512SAGMFI013 Datasheet, Spansion Distributor | |
![]() | NIF9N05CLT1G | MOSFET N-CH 59V 2.6A SOT223 | datasheet.pdf | |
![]() | RCC50DRYI | CONN EDGECARD 100PS DIP .100 SLD | datasheet.pdf | |
![]() | TPS75133QPWPG4 | IC REG LDO 3.3V 1.5A 20HTSSOP | datasheet.pdf | |
![]() | 189-015-513R671 | D-Sub Connector Receptacle, Female Sockets 15, 15 Position Board Edge, Through Hole, Right Angle Solder | datasheet.pdf | |
![]() | SC3316FH-2R7 | FIXED IND 2.7UH 6.4A 12 MOHM SMD | datasheet.pdf | |
![]() | 0761500016 | IMPACT DC 6X16 OPEN SN/PB | datasheet.pdf | |
![]() | MI-26J-IW-S | CONVERT DC/DC 270VIN 36VOUT 100W | datasheet.pdf | |
![]() | ER1537-02JR | FIXED IND 220NH 1.81A 55 MOHM TH | datasheet.pdf | |
![]() | RAA230211GSB#HA0 | IC REG DL BCK/LINEAR 20-HTSSOP | datasheet.pdf | |
![]() | EBC10DTKH-S288 | CONN EDGECARD 20POS .100" | datasheet.pdf | |
![]() | SI8610AB-B-ISR | DGTL ISO 2.5KV GEN PURP 8SOIC | datasheet.pdf | |
![]() | D-106-6025 | SHIELD TERMINATOR | datasheet.pdf |