Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-S9S08DZ60F2MLH | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Gold to Copper Wire 31/Jul/2013 | |
| PCN Assembly/Origin | Burn-In Site Expansion 26/Nov/2013 | |
| Standard Package | 800 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | S08 | |
| Packaging | Tray | |
| Core Processor | S08 | |
| Core Size | 8-Bit | |
| Speed | 40MHz | |
| Connectivity | CAN, I²C, LIN, SCI, SPI | |
| Peripherals | LVD, POR, PWM, WDT | |
| Number of I/O | 53 | |
| Program Memory Size | 60KB (60K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 2K x 8 | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.7 V ~ 5.5 V | |
| Data Converters | A/D 24x12b | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 64-LQFP | |
| Supplier Device Package | 64-LQFP (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | S9S08DZ60F2MLH | |
| Related Links | S9S08DZ, S9S08DZ60F2MLH Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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