Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SAK-XC167CI-16F40F BB | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Pin 1 Marking 05/Jun/2014 Mold Cavity Update 01/Jul/2015 | |
| PCN Assembly/Origin | Grinding Location Change 18/Feb/2014 | |
| PCN Packaging | Packing Belt 17/Dec/2013 | |
| Standard Package | 360 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | XC16x | |
| Packaging | Tray | |
| Core Processor | C166SV2 | |
| Core Size | 16-Bit | |
| Speed | 40MHz | |
| Connectivity | CAN, EBI/EMI, I²C, SPI, UART/USART | |
| Peripherals | PWM, WDT | |
| Number of I/O | 103 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 2.7 V | |
| Data Converters | A/D 16x8/10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 144-LQFP | |
| Supplier Device Package | 144-TQFP (20x20) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SAK-XC167CI-16F40F BB | |
| Related Links | SAK-XC167C, SAK-XC167CI-16F40F BB Datasheet, Infineon Technologies Distributor | |
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