Samsung Semiconductor, Inc. SI-B8P09626001
- Mfg. Part Number
- SI-B8P09626001
- Manufacturer
- Samsung Semiconductor, Inc.
- Product Category
- LED Lighting - COBs, Engines, Modules
- Brief Description
- LED 6500K 80CRI LM561B
- Datasheet Download
- SI-B8P09626001.pdf
Availability of SI-B8P09626001
Available Quantity
5080 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 8.11800
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of SI-B8P09626001, we specialize in Samsung Semiconductor, Inc. all series electronic components. SI-B8P09626001 can be shipped within 24 hours after order. If you have any demands for SI-B8P09626001, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- SI-B8P09626001 Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
SI-B8P09626001
| Internal Part Number | EIS-SI-B8P09626001 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Lighting Product Selector | |
| Standard Package | 60 | |
| Category | Optoelectronics | |
| Family | LED Lighting - COBs, Engines, Modules | |
| Series | Finger-SQ32B | |
| Packaging | Tray | |
| Type | LED Module | |
| Color | White, Cool | |
| CCT (K) | 6500K 4-Step MacAdam Ellipse | |
| Wavelength | - | |
| Configuration | Rectangle | |
| Flux @ Current/Temperature - Test | 1380 lm (Typ) | |
| Current - Test | 385mA | |
| Temperature - Test | 35°C | |
| Voltage - Forward (Vf) (Typ) | 24V | |
| Lumens/Watt @ Current - Test | 149 lm/W | |
| Current - Max | 600mA | |
| CRI (Color Rendering Index) | 80 | |
| Viewing Angle | 115° | |
| Features | With Connector | |
| Size / Dimension | 259.00mm L x 250.00mm W | |
| Height | 5.80mm | |
| Light Emitting Surface (LES) | - | |
| Lens Type | Flat | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SI-B8P09626001 | |
| Related Links | SI-B8P0, SI-B8P09626001 Datasheet, Samsung Semiconductor, Inc. Distributor | |
SI-B8P09626001 Details Description
Related parts for SI-B8P09626001
 | LT1360CS8#PBF | IC OPAMP VFB 50MHZ 8SO | datasheet.pdf | |
 | AWHW50A-0202-T-R | CONN HEADR R/A LO-PRO 50POS GOLD | datasheet.pdf | |
 | RT0805BRE0756KL | RES SMD 56K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
 | ADZS-BFFPGA-EZEXT | BOARD EVAL FPGA BLACKFIN EXTENDR | datasheet.pdf | |
 | IDT5V9885PFGI | IC CLK GEN 3.3V EEPROM 32-TQFP | datasheet.pdf | |
 | 9-146295-0 | CONN HEADER BREAKAWAY 40POS .100 | datasheet.pdf | |
 | CY3250-20346QFN | ICE POD DEBUG CY8C20236 | datasheet.pdf | |
| S332K53Y5PP63K7R | CAP CER 3300PF 2KV Y5P RADIAL | datasheet.pdf | |
 | CMF5514K600BEEB | RES 14.6K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
 | AP7361-33D-13 | IC REG LDO 3.3V 1A TO252 | datasheet.pdf | |
| 2306391 | CONN TERM BLOCK | datasheet.pdf | |
| ABC50DTMN-S273 | CONN EDGECARD 100POS .100" | datasheet.pdf |