Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SI3050DC1-EVB | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation and Demonstration Boards and Kits | |
| Series | - | |
| Main Purpose | Telecom, Data Acquisition Arrangement (DAA) | |
| Embedded | - | |
| Utilized IC / Part | Si3050 | |
| Primary Attributes | - | |
| Secondary Attributes | - | |
| Supplied Contents | Board | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SI3050DC1-EVB | |
| Related Links | SI3050, SI3050DC1-EVB Datasheet, Silicon Labs Distributor | |
![]() | 70246-4022 | CONN HEADER 40POS .100 VERT GOLD | datasheet.pdf | |
![]() | T48C862M-R4-TNQ | IC MON TIRE PRESS 433MHZ 24-SOIC | datasheet.pdf | |
![]() | 2-520306-2 | Connector Quick Connect Receptacle 18-22 AWG 0.110" (2.79mm), 0.125" (3.18mm) Crimp | datasheet.pdf | |
![]() | 150-90-210-00-001000 | HEADER OPEN .018"DIA .200 10POS | datasheet.pdf | |
![]() | VI-B2W-EX-F3 | CONVERTER MOD DC/DC 5.5V 75W | datasheet.pdf | |
![]() | VI-BWD-MW-S | CONVERTER MOD DC/DC 85V 100W | datasheet.pdf | |
![]() | M55342K02B1B27RT5 | RES SMD 1.27K OHM 0.1% 1/8W 0505 | datasheet.pdf | |
![]() | 801-83-036-10-003101 | Connector Socket 36 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 95035-130HLF | HEADER BERGSTIK R/A | datasheet.pdf | |
![]() | ATS-02A-53-C3-R0 | HEATSINK 30X30X30MM L-TAB T412 | datasheet.pdf | |
![]() | DSC1001DE1-020.0000 | OSC MEMS 20.000MHZ CMOS SMD | datasheet.pdf | |
![]() | AD754TD | 12-Bit Buffered Miltiplying CMOS D/A Converter IC | datasheet.pdf |