FFF SIP050-1X17-157BLF
- Mfg. Part Number
- SIP050-1X17-157BLF
- Manufacturer
- FFF
- Product Category
- Sockets for ICs, Transistors
- Brief Description
- CONN SOCKET SIP 17POS TIN
- Datasheet Download
- SIP050-1X17-157BLF.pdf
Availability of SIP050-1X17-157BLF
Available Quantity
5020 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of SIP050-1X17-157BLF, we specialize in FFF all series electronic components. SIP050-1X17-157BLF can be shipped within 24 hours after order. If you have any demands for SIP050-1X17-157BLF, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- SIP050-1X17-157BLF Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
SIP050-1X17-157BLF
| Internal Part Number | EIS-SIP050-1X17-157BLF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices/Sockets 04/Dec/2008 | |
| Standard Package | 400 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | SIP050-1x | |
| Packaging | Bulk | |
| Type | SIP | |
| Number of Positions or Pins (Grid) | 17 (1 x 17) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Tin | |
| Contact Finish Thickness - Mating | 200µin (5.08µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | 200µin (5.08µm) | |
| Contact Material - Post | Brass | |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
| Operating Temperature | - | |
| Termination Post Length | 0.095" (2.41mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | - | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SIP050-1X17-157BLF | |
| Related Links | SIP050-1X, SIP050-1X17-157BLF Datasheet, FFF Distributor | |
SIP050-1X17-157BLF Details Description
Related parts for SIP050-1X17-157BLF
 | RNF14BTD2K61 | RES 2.61K OHM 1/4W .1% AXIAL | datasheet.pdf | |
 | 1838246-1 | CONN FMALE M12 5POS STR 2M CABLE | datasheet.pdf | |
| 58245-3 | BOARD TOOL ASSY | datasheet.pdf | |
.jpg) | 2-1879257-6 | RES SMD 301 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
| NH1CG25 | FUSE LINK 500V GL NH 25A SIZE1 | datasheet.pdf | |
| ST1W008S4KR300 | CONN MICRO SD CARD HINGED TYPE | datasheet.pdf | |
 | CY14B104NA-BA25I | IC NVSRAM 4MBIT 25NS 48FBGA | datasheet.pdf | |
-9.jpg) | C1608X6S1A475K080AC | CAP CER 4.7UF 10V X6S 0603 | datasheet.pdf | |
| VE-JNB-MZ | CONVERTER MOD DC/DC 95V 25W | datasheet.pdf | |
 | ESR18EZPF2372 | RES SMD 23.7K OHM 1% 1/3W 1206 | datasheet.pdf | |
| ATS-11H-173-C3-R0 | HEATSINK 30X30X30MM R-TAB T412 | datasheet.pdf | |
 | XC4VFX100-11FF1152C | Field Programmable Gate Array, 10544 CLBs, 1181MHz, 94896-Cell, CMOS, PBGA1152 IC | datasheet.pdf |