Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SIP1X09-001BLF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices/Sockets 04/Dec/2008 | |
| Standard Package | 1,200 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | SIP1x | |
| Packaging | Bulk | |
| Type | SIP | |
| Number of Positions or Pins (Grid) | 9 (1 x 9) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Gold | |
| Contact Finish Thickness - Mating | 30µin (0.76µm) | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | 200µin (5.08µm) | |
| Contact Material - Post | Brass | |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | |
| Operating Temperature | - | |
| Termination Post Length | 0.125" (3.18mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | - | |
| Contact Resistance | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SIP1X09-001BLF | |
| Related Links | SIP1X09, SIP1X09-001BLF Datasheet, FFF Distributor | |
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