Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SJ5307 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Video File | 3M™ Bumpon™ Protective Products | |
| Standard Package | 3,000 | |
| Category | Hardware, Fasteners, Accessories | |
| Family | Bumpers, Feet, Pads, Grips | |
| Series | Bumpon™, SJ5300 | |
| Shape | Square, Tapered | |
| Color | Clear | |
| Size / Dimension | 0.413" L x 0.413" W (10.49mm x 10.49mm) | |
| Thickness | 0.098" (2.50mm) | |
| Material | Polyurethane | |
| Hardness | 75 Shore M | |
| Form | Sheet | |
| Mounting Type | Adhesive, Acrylic | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SJ5307 | |
| Related Links | SJ5, SJ5307 Datasheet, 3M Distributor | |
![]() | 9T12062A5113DBHFT | RES SMD 511K OHM 0.5% 1/8W 1206 | datasheet.pdf | |
![]() | 310-93-111-41-001000 | Connector Receptacle 11 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | XC3S400A-4FG400C | IC FPGA 311 I/O 400FBGA | datasheet.pdf | |
![]() | E2E-X8MD1-M1J 0.3M | SENS PROX M12 8MM DC2W-NO .3M | datasheet.pdf | |
![]() | 430610-23-0 | Connector Barrier Block Strip 23 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | RLR07C1152FRRSL | RES 11.5K OHM 1% 1/4W AXIAL | datasheet.pdf | |
![]() | DTS26F23-35SA-LC | CONN HSG PLUG STRGHT 100POS SKT | datasheet.pdf | |
![]() | DLP-RFID2 | RFID SMT MODULE R/W | datasheet.pdf | |
![]() | T 3638 414 | FEMALE RECEPTACLE 12WAY | datasheet.pdf | |
![]() | ECC18DCTI-S371 | CONN EDGECARD 36POS .100" | datasheet.pdf | |
![]() | M200X042FPT | MARKER PLATE NUCLEAR | datasheet.pdf | |
![]() | LQP03TN10NJO4D | Capacitors Inductors Filters... | datasheet.pdf |