Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SMD32 | |
| Lead Free Status / RoHS Status | ||
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| MSDS Material Safety Datasheet | SMDx,SMD2000 MSDS | |
| Standard Package | 1 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Accessories | |
| Series | - | |
| Accessory Type | Removal Alloy | |
| For Use With/Related Products | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SMD32 | |
| Related Links | SM, SMD32 Datasheet, Chip Quik Distributor | |
![]() | M3BYK-2660K | IDC CABLE - MSR26K/MC26F/MPD26K | datasheet.pdf | |
![]() | RG2012P-4640-W-T1 | RES SMD 464 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | VJ2220Y183KBCAT4X | CAP CER 0.018UF 200V X7R 2220 | datasheet.pdf | |
![]() | IMC0603ER27NJ01 | FIXED IND 27NH 600MA 220 MOHM | datasheet.pdf | |
![]() | B44020B2B30 | AL-ELKO ISOLATION DISC | datasheet.pdf | |
| UVC2G100MPD1TD | CAP ALUM 10UF 20% 400V RADIAL | datasheet.pdf | ||
![]() | ATS-20C-145-C1-R0 | HEATSINK 30X30X30MM L-TAB | datasheet.pdf | |
![]() | AISC-0603F-R10K-T | FIXED IND 100NH 850MA 110 MOHM | datasheet.pdf | |
![]() | DDMAK50SNMBK47 | DDMAK50SNMBK47 | datasheet.pdf | |
![]() | GJM0335C1E9R5DB01J | CAP CER 9.5PF 25V NP0 0201 | datasheet.pdf | |
![]() | NB649EQJ-LF-Z | IC REG BUCK ADJ 8A SYNC | datasheet.pdf | |
![]() | D38999/20MC4JB | CONN RCPT 4POS FLANGE W/SKT | datasheet.pdf |