Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SMDLTLFP250T3 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| MSDS Material Safety Datasheet | SMDLTLFP Series | |
| Standard Package | 1 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Solder | |
| Series | CHIPQUIK® | |
| Process | Lead Free | |
| Type | Solder Paste | |
| Flux Type | No-Clean | |
| Composition | Sn42Bi58 (42/58) | |
| Wire Gauge | - | |
| Diameter | - | |
| Core Size | - | |
| Form | Jar, 250g (9 oz) | |
| Melting Point | 281°F (138°C) | |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SMDLTLFP250T3 | |
| Related Links | SMDLTL, SMDLTLFP250T3 Datasheet, Chip Quik Distributor | |
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