Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SMDSWLF.031 4OZ | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Soldering, Desoldering, Rework Products | |
| Family | Solder | |
| Series | CHIPQUIK® | |
| Process | Lead Free | |
| Type | Wire Solder | |
| Flux Type | No-Clean | |
| Composition | Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) | |
| Wire Gauge | 20 AWG, 21 SWG | |
| Diameter | 0.031" (0.79mm) | |
| Core Size | 2.2% | |
| Form | Spool, 113g (1/4 lb) | |
| Melting Point | 429.8°F (221°C) | |
| Shipping Info | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SMDSWLF.031 4OZ | |
| Related Links | SMDSWLF, SMDSWLF.031 4OZ Datasheet, Chip Quik Distributor | |
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