Ship from: HONGKONG
								Date Code: Newest Date Code
								Manufacturer lead time 6 weeks
| Internal Part Number | EIS-SP900S-0.009-00-105 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Sil-Pad Metric Configurations | |
| MSDS Material Safety Datasheet | Sil-Pad 900S MSDS | |
| RoHS Information | Sil-Pad 900-S Material Report | |
| Featured Product | Sil-Pad® 900S | |
| Standard Package | 100 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Sil-Pad® 900-S | |
| Usage | SIP | |
| Shape | Rectangle | |
| Outline | 36.83mm x 21.29mm | |
| Thickness | 0.009" (0.229mm) | |
| Material | Silicone Rubber | |
| Adhesive | - | |
| Backing, Carrier | Fiberglass | |
| Color | Pink | |
| Thermal Resistivity | 0.61°C/W | |
| Thermal Conductivity | 1.6 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | SP900S-0.009-00-105 | |
| Related Links | SP900S-0., SP900S-0.009-00-105 Datasheet, Bergquist Distributor | |
|  | XCV800-5FG680I | IC FPGA 512 I/O 680FBGA | datasheet.pdf | |
|  | 1644580000 | TERM BLOCK HDR 10POS 3.5MM | datasheet.pdf | |
|  | MAX188AEPP | IC ADC LP 12-BIT 133KSPS 20-DIP | datasheet.pdf | |
|  | MIC5255-2.6YM5-TR | IC REG LDO 2.6V 0.15A SOT23-5 | datasheet.pdf | |
|  | AD737ARZ | IC TRUE RMS/DC CONV LP 8SOIC | datasheet.pdf | |
|  | 831709C2.DL | SNSW 0.1A SLDR PLNSCRW79218491 | datasheet.pdf | |
|  | CMF551K5000FHEK70 | RES 1.5K OHM 1/2W 1% AXIAL | datasheet.pdf | |
|  | 501LBK-ADAG | OSC PROG 1.8V 1.3NS 30PPM 2X2.5 | datasheet.pdf | |
|  | D25K7K0 | RESISTOR POWER ADJ 7K OHM 25W | datasheet.pdf | |
|  | EC0426-000 | MARKERS | datasheet.pdf | |
|  | MS24266R22B55SY | 26500 55C 55#20 SKT PLUG | datasheet.pdf | |
|  | AD7536TE | LC2MOS 14-BIT uP-COMPATIBLE DAC IC | datasheet.pdf |