Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TC58NVG0S3HTAI0 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 96 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM - NAND | |
| Memory Size | 1G (128M x 8) | |
| Speed | 25ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) | |
| Supplier Device Package | 48-TSOP I | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TC58NVG0S3HTAI0 | |
| Related Links | TC58NVG, TC58NVG0S3HTAI0 Datasheet, Toshiba Semiconductor & Storage Distributor | |
![]() | 9T08052A93R1FBHFT | RES SMD 93.1 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | PTH12030LAH | MODULE PIP .8-1.8V 26A T/H 13DIP | datasheet.pdf | |
![]() | 0225003.MXP | FUSE GLASS 3A 250VAC 125VDC 2AG | datasheet.pdf | |
![]() | MCU08050D2151BP500 | RES SMD 2.15K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | RWR81S4R02BPB12 | RES 4.02 OHM 1W 0.1% WW AXIAL | datasheet.pdf | |
![]() | 16MS747MEFCT55X7 | CAP ALUM 47UF 20% 16V RADIAL | datasheet.pdf | |
![]() | 1037450000 | CONN HEADER 13POS 3.81MM BLACK | datasheet.pdf | |
| MBC201-1015G | AC/DC CONVERTER 15V 160W | datasheet.pdf | ||
![]() | 160-822HS | FIXED IND 8.2UH 230MA 2.4 OHM | datasheet.pdf | |
![]() | 87382-126HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | D38999/24JG16AC | CONN HSG RCPT JAM NUT 16POS PIN | datasheet.pdf | |
![]() | XC95288XL-6TQ144I | XC95288XL High Performance CPLD IC | datasheet.pdf |