Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TDZ3V3J,115 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOD323F Bond Wire from Au to Cu & 2nd Source Mold 2/Nov/2015 | |
| Standard Package | 3,000 | |
| Category | Discrete Semiconductor Products | |
| Family | Diodes - Zener - Single | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Voltage - Zener (Nom) (Vz) | 3.3V | |
| Tolerance | ±2% | |
| Power - Max | 500mW | |
| Impedance (Max) (Zzt) | 95 Ohm | |
| Current - Reverse Leakage @ Vr | 5µA @ 1V | |
| Voltage - Forward (Vf) (Max) @ If | 1.1V @ 100mA | |
| Operating Temperature | -55°C ~ 150°C | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-90, SOD-323F | |
| Supplier Device Package | SOD-323F | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TDZ3V3J,115 | |
| Related Links | TDZ3V, TDZ3V3J,115 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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