Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TI900-20-10-0.12 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | Die-Cut Tolerence Guide | |
| Product Training Modules | TI900 Silicone Based Thermally Conductive Insulators Thermal Interface Product Selection Thermally Conductive Gap Filler Rolls Product Range | |
| MSDS Material Safety Datasheet | Ti900 MSDS | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Ti900 | |
| Usage | Sheet | |
| Shape | Rectangle | |
| Outline | 20.00mm x 10.00mm | |
| Thickness | 0.0050" (0.127mm) | |
| Material | Silicone | |
| Adhesive | - | |
| Backing, Carrier | Viscose | |
| Color | White | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 1.8 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TI900-20-10-0.12 | |
| Related Links | TI900-20, TI900-20-10-0.12 Datasheet, t-Global Technology Distributor | |
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