Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TK-850/SG2+NET | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | V850 | |
| Board Type | Evaluation Platform | |
| Type | MCU 32-Bit | |
| Core Processor | V850ES | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | UPD70F3281, V850ES/SG2 | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TK-850/SG2+NET | |
| Related Links | TK-850/, TK-850/SG2+NET Datasheet, Renesas Electronics America Distributor | |
![]() | FMC35DRXH | CONN EDGECARD 70POS DIP .100 SLD | datasheet.pdf | |
![]() | LFSKTP1C | HARDWARE 196-PIN 1.0MM Z | datasheet.pdf | |
![]() | VE-J63-CY-F1 | CONVERTER MOD DC/DC 24V 50W | datasheet.pdf | |
![]() | 0634462510 | INSULATION PUNCH | datasheet.pdf | |
![]() | RN55D1371FBSL | RES 1.37K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | PATT0603E24R9BGT1 | RES SMD 24.9 OHM 0.1% 0.15W 0603 | datasheet.pdf | |
![]() | ATS-12D-41-C2-R0 | HEATSINK 57.9X60.96X17.78MM T766 | datasheet.pdf | |
![]() | NLV37WZ16USG | IC BUFFER TRIPLE HI PERFORM US8 | datasheet.pdf | |
![]() | SO63-5-9036-20 | SOLDER SHIELD TERM 20 AWG LEAD | datasheet.pdf | |
![]() | 9-1437508-1 | CONN TRANSIST | datasheet.pdf | |
![]() | BXRE-35E0400-B-23 | LED V6 3500K 400LM 80CRI WW | datasheet.pdf | |
![]() | RGLD8X102J | Capacitors Inductors Filters... | datasheet.pdf |