Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-TWR-S08DC-AC60 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | HCS08 | |
| Board Type | Evaluation Platform | |
| Type | MCU 8-Bit | |
| Core Processor | HCS08 | |
| Operating System | - | |
| Platform | Freescale Tower System | |
| For Use With/Related Products | MC9S08AC60 | |
| Mounting Type | Fixed | |
| Contents | Board(s) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | TWR-S08DC-AC60 | |
| Related Links | TWR-S08, TWR-S08DC-AC60 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | 0230.600MRT1SSP | FUSE GLASS 600MA 250VAC 125VDC | datasheet.pdf | |
![]() | 2037-60-B5LF | GDT 600V 15% 5KA THROUGH HOLE | datasheet.pdf | |
![]() | OSTTZ200101 | TERM BLOCK RISING CLAMP 20POS | datasheet.pdf | |
![]() | OMAPL137CZKBA3 | IC MPU OMAP-L1X 375MHZ 256BGA | datasheet.pdf | |
![]() | RLR07C45R3FSB14 | RES 45.3 OHM 1% 1/4W AXIAL | datasheet.pdf | |
![]() | 2EZ24D2/TR12 | DIODE ZENER 24V 2W DO204AL | datasheet.pdf | |
| UKL1C220MDD1TD | CAP ALUM 22UF 20% 16V RADIAL | datasheet.pdf | ||
![]() | EBC15DCBH-S189 | CONN EDGECARD 30POS .100" | datasheet.pdf | |
![]() | 4PB646-T2 | SWITCH TOGGLE | datasheet.pdf | |
![]() | 67L080-0344 | THERMOSTAT 80 DEG NC TO-220 | datasheet.pdf | |
![]() | 1855245-2 | HDM W/FA SSPR142F255O K CUTS | datasheet.pdf | |
![]() | D38999/26FD97HD-LC | CONN HSG PLUG STRGHT 12POS PIN | datasheet.pdf |