Renesas Electronics America UPD70F3747GB-GAH-AX

UPD70F3747GB-GAH-AX picture photo
Mfg. Part Number
UPD70F3747GB-GAH-AX
Manufacturer
Product Category
Embedded - Microcontrollers
Brief Description
IC MCU 32BIT 128KB FLASH 64LQFP
Datasheet Download
UPD70F3747GB-GAH-AX.pdf
Availability of UPD70F3747GB-GAH-AX

Available Quantity

5020 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 6.17100
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of UPD70F3747GB-GAH-AX, we specialize in Renesas Electronics America all series electronic components. UPD70F3747GB-GAH-AX can be shipped within 24 hours after order. If you have any demands for UPD70F3747GB-GAH-AX, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
UPD70F3747GB-GAH-AX Order Process
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Specifications of UPD70F3747GB-GAH-AX
Internal Part NumberEIS-UPD70F3747GB-GAH-AX
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)3 (168 Hours)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Design ResourcesDevelopment Tool Selector
Standard Package1
Category Integrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
SeriesV850ES/Hx3
PackagingTray
Core ProcessorV850ES
Core Size32-Bit
Speed32MHz
ConnectivityCSI, I²C, UART/USART
PeripheralsDMA, LVD, PWM, WDT
Number of I/O51
Program Memory Size128KB (128K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size8K x 8
Voltage - Supply (Vcc/Vdd)3.7 V ~ 5.5 V
Data ConvertersA/D 10x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C
Package / Case64-LQFP
Supplier Device Package*
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)UPD70F3747GB-GAH-AX
Related LinksUPD70F374, UPD70F3747GB-GAH-AX Datasheet, Renesas Electronics America Distributor
UPD70F3747GB-GAH-AX Details Description
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