Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-UPD70F3750GK-GAK-AX | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microcontrollers | |
Series | V850ES/Hx3 | |
Packaging | Tray | |
Core Processor | V850ES | |
Core Size | 32-Bit | |
Speed | 32MHz | |
Connectivity | CSI, I²C, UART/USART | |
Peripherals | DMA, LVD, PWM, WDT | |
Number of I/O | 67 | |
Program Memory Size | 256KB (256K x 8) | |
Program Memory Type | FLASH | |
EEPROM Size | - | |
RAM Size | 16K x 8 | |
Voltage - Supply (Vcc/Vdd) | 3.7 V ~ 5.5 V | |
Data Converters | A/D 12x10b | |
Oscillator Type | Internal | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 80-LQFP | |
Supplier Device Package | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | UPD70F3750GK-GAK-AX | |
Related Links | UPD70F375, UPD70F3750GK-GAK-AX Datasheet, Renesas Electronics America Distributor |
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