Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-UPMP-F960-MLCD-EK | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Design Resources | Development Tool Selector | |
Standard Package | 1 | |
Category | Programmers, Development Systems | |
Family | Evaluation Boards - Embedded - MCU, DSP | |
Series | - | |
Board Type | Evaluation Platform | |
Type | MCU 8-Bit | |
Core Processor | 8051 | |
Operating System | - | |
Platform | Unified Development Platform | |
For Use With/Related Products | C8051F960 | |
Mounting Type | Fixed | |
Contents | Board(s), LCD | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | UPMP-F960-MLCD-EK | |
Related Links | UPMP-F96, UPMP-F960-MLCD-EK Datasheet, Silicon Labs Distributor |
![]() | MCP73827-4.2VUA | IC CONTROLLR LI-ION 4.2V 8-MSOP | datasheet.pdf | |
![]() | 74ACT11139PWR | IC DUAL 2-4 DECOD/DEMUX 16-TSSOP | datasheet.pdf | |
![]() | TMM-130-01-S-D | CONN HEADER 60POS DUAL 2MM T/H | datasheet.pdf | |
![]() | MS3101F10SL-4P | CONN RCPT 2POS FREE HNG W/PINS | datasheet.pdf | |
![]() | S558-5999-U5-F | XFRMR MODULE LAN 10/100BT 16P SM | datasheet.pdf | |
![]() | 42412-5 | CONN STRAIN RELIEF WING .025AL | datasheet.pdf | |
![]() | 1226350000 | LUP 10.16/08/90 3.2SN BK BX | datasheet.pdf | |
![]() | 1N646-1 | DIODE GEN PURP 300V 400MA DO35 | datasheet.pdf | |
![]() | ATS-04H-44-C3-R0 | HEATSINK 25X25X15MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-05D-123-C3-R0 | HEATSINK 50X50X20MM XCUT T412 | datasheet.pdf | |
![]() | CT3209-5 | FUSED MODULAR PROBE 0.5A/660V GR | datasheet.pdf | |
![]() | SKY67130-396LF-EVB | SKY67130-396LF EVAL BRD | datasheet.pdf |